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MIMIC SYSTEMS INC.

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Company Details

Name: MIMIC SYSTEMS INC.
Jurisdiction: New York
Legal type: FOREIGN BUSINESS CORPORATION
Status: Active
Date of registration: 23 Nov 2016 (9 years ago)
Entity Number: 5042725
ZIP code: 11205
County: New York
Place of Formation: Delaware
Principal Address: 19 Morris Avenue, Newlab Building #128, Brooklyn, NY, United States, 11205
Address: 19 MORRIS AVENUE, NEWLAB BUILDING #128, BROOKLYN, NY, United States, 11205

DOS Process Agent

Name Role Address
THE CORPORATION DOS Process Agent 19 MORRIS AVENUE, NEWLAB BUILDING #128, BROOKLYN, NY, United States, 11205

Chief Executive Officer

Name Role Address
BERARDO MATALUCCI Chief Executive Officer 19 MORRIS AVENUE, NEWLAB BUILDING #128, BROOKLYN, NY, United States, 11205

Commercial and government entity program

The The Commercial And Government Entity Code (CAGE) is assigned by the Department of Defense's Defense Logistics Agency (DLA) and represents your company's physical address for GSA's mailings, payments, and administrative records.

Note: A CAGE Code enables a company to contract with the U.S. government, allowing bid on government contracts and to receive government payments. Also for business this means that it's a Verified business entity and Has a validated physical address.

CAGE number:
7SAM8
Status:
Obsolete
Type:
Non-Manufacturer
CAGE Update Date:
2024-11-19
SAM Expiration:
2025-11-17

Contact Information

POC:
BERARDO MATALUCCI

History

Start date End date Type Value
2024-11-18 2024-11-18 Address 424 E 57TH STREET, 4A, NEW YORK, NY, 10022, USA (Type of address: Chief Executive Officer)
2024-11-18 2024-11-18 Address 19 MORRIS AVENUE, NEWLAB BUILDING #128, BROOKLYN, NY, 11205, USA (Type of address: Chief Executive Officer)
2023-01-31 2024-11-18 Address 424 E 57TH STREET, 4A, NEW YORK, NY, 10022, USA (Type of address: Chief Executive Officer)
2023-01-31 2024-11-18 Address 19 morris ave,, newlab building #128, BROOKLYN, NY, 11205, USA (Type of address: Service of Process)
2016-11-23 2023-01-31 Address 435 E 76TH STREET, 4D, NEW YORK, NY, 10021, USA (Type of address: Service of Process)

Filings

Filing Number Date Filed Type Effective Date
241118004625 2024-11-18 BIENNIAL STATEMENT 2024-11-18
230131002736 2023-01-27 CERTIFICATE OF CHANGE BY ENTITY 2023-01-27
230119001515 2023-01-19 BIENNIAL STATEMENT 2022-11-01
161123000250 2016-11-23 APPLICATION OF AUTHORITY 2016-11-23

USAspending Awards / Financial Assistance

Date:
2024-07-10
Awarding Agency Name:
National Science Foundation
Transaction Description:
SBIR PHASE I: REFRIGERANT-FREE HEAT PUMP USING HIGH-PERFORMANCE THERMOELECTRIC MATERIALS AND METHODS -THE BROADER IMPACT OF THIS SMALL BUSINESS INNOVATION RESEARCH (SBIR) PHASE I PROJECT IS THROUGH THE DEVELOPMENT OF A MORE EFFICIENT AND COST-COMPETITIVE SOLID-STATE HEAT PUMP TECHNOLOGY FOR HEATING AND COOLING. BUILDINGS ARE ONE OF THE LARGEST CONTRIBUTORS TO CARBON EMISSIONS, SUBSTANTIALLY ASSOCIATED WITH HEATING, COOLING, AND DOMESTIC HOT WATER PRODUCTION. AS AN ALL- ELECTRIC TECHNOLOGY, SOLID-STATE HEAT PUMPS CAN EASILY BE POWERED DIRECTLY BY RENEWABLE POWER, SUCH AS SOLAR OR WIND. THIS WOULD NOT ONLY REDUCE RELIANCE ON FOSSIL FUELS BUT WILL ALSO CONTRIBUTE TO THE SUSTAINABLE ELECTRIFICATION OF THE BUILT ENVIRONMENT THAT IS NECESSARY TO MITIGATE THE EFFECTS OF CLIMATE CHANGE. THIS REFRIGERANT-FREE TECHNOLOGY MAY ALSO AVOID REFRIGERANT LEAKS THAT CONTRIBUTE TO CLIMATE CHANGE. AS A RETROFIT, IT WOULD ENABLE MULTIFAMILY RESIDENTIAL BUILDINGS TO COMPLY WITH THE EMERGING MORE STRINGENT CARBON EMISSION STANDARDS. IN NEW YORK CITY ALONE, THIS REPRESENTS A POTENTIAL $2.2 B MARKET. THIS PROJECT AIMS TO INCREASE THE EFFICIENCY AND COST-EFFECTIVENESS OF TRADITIONAL SOLID-STATE HEAT PUMPS BASED ON THERMOELECTRIC ENERGY CONVERSION BY LEVERAGING NEW THERMOELECTRIC MATERIALS AND MODERN MANUFACTURING PROCESSES TO SURPASS THE PERFORMANCE OF TRADITIONAL VAPOR-COMPRESSION HEAT PUMPS. THE APPROACH AIMS TO INTEGRATE THE ACTIVE COMPONENTS OF THERMOELECTRIC HEAT PUMPS, SPECIFICALLY THE THERMOELECTRIC LEGS AND ELECTRODES, DIRECTLY AND IN INTIMATE THERMAL CONTACT WITH ACTIVE HEAT EXCHANGER SURFACES LEVERAGING INK-BASED THERMOELECTRIC SYSTEMS WITH HIGH FIGURE OF MERIT. THE PROPOSED CONFIGURATION AND MANUFACTURING PROCESS MINIMIZES THE DELETERIOUS INTERFACE AND HEAT PUMP SUBSTRATE THERMAL RESISTANCES, INCREASING THE SYSTEM PERFORMANCE. A MULTI-DISCIPLINARY TEAM WILL INTEGRATE SCALABLE FABRICATION PROCESSES FOR THERMOELECTRIC MATERIALS USING SINTERING WITH PRINTABLE ELECTRONICS ON METAL CORE SUBSTRATES. THE GOAL OF THIS PROJECT IS TO DETERMINE THE FEASIBILITY OF THE APPROACH BY BUILDING AND TESTING A REPRESENTATIVE ASSEMBLY THAT CAN BE EASILY SCALED UP TO PROVIDE LARGER HEATING AND COOLING CAPACITIES. THIS APPROACH CONSTITUTES A RADICAL REDESIGN TO HOW THERMOELECTRIC SYSTEMS ARE ASSEMBLED, UNLOCKING NEW OPPORTUNITIES TOWARD DELIVERING SUSTAINABLE AND SCALABLE SOLUTIONS FOR HEATING AND COOLING. THIS AWARD REFLECTS NSF'S STATUTORY MISSION AND HAS BEEN DEEMED WORTHY OF SUPPORT THROUGH EVALUATION USING THE FOUNDATION'S INTELLECTUAL MERIT AND BROADER IMPACTS REVIEW CRITERIA.- SUBAWARDS ARE PLANNED FOR THIS AWARD.
Obligated Amount:
275000.00
Face Value Of Loan:
0.00
Total Face Value Of Loan:
0.00

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Date of last update: 24 Mar 2025

Sources: New York Secretary of State